Sicut duxit ostentationem screens sunt late usi, qui habent altius requisita pro uber qualitas et display effectus. In packaging processus, Traditional SMD technology potest non occurrit applicationem requisita de aliquibus missionibus. Ex hoc aliqui manufacturers mutata packaging track et elegit deploy MANNUS et alia technologies, cum aliqua manufacturers elegit ut amplio SMD technology. Inter eos, Gob technology est iterative technology post emendationem SMD packaging processus.
Itaque cum Gob technology, potest duci ostentationem products consequi latius applications? Quid flecte erit futurum foro progressionem Gob Show? Lets 'take a vultus?
Since the development of the LED display industry, including COB display, a variety of production and packaging processes have emerged one after another, from the previous direct insertion (DIP) process, to the surface mount (SMD) process, to the emergence of COB packaging technology, and finally to the emergence of GOB packaging technology.
⚪What est MANNUS packaging technology?
MANNUS packaging significat quod directe adhaeret chip ad PCB subiectum ad electrica hospites. Et principalis propositum est solvere calor dissipatio quaestio de DUXERIT Display Screens. Comparari cum recta obturaculum, in et SMD, eius characteres sunt spatii salva, simplicior packaging operationes et efficiens scelerisque administratione. Currently, MANNUS packaging est maxime usus est in aliqua parva-picem products.
Quid commoda COB packaging technology?
I. Ultra-lux tenuis: secundum ad ipsam necessitatibus customers, PCB tabulam cum crassitudine 0.4-1.2mm potest ad redigendum pondus ad minus 1/3 de originali traditional products, quod potest significantly ad redigendum in teloniatores, translationem et ipsum sumptibus et ipsum.
II. Anti-collisione et pressura resistentia: Cob products directe encapsulate DUXERIT chip in concava situ PCB Board, et deinde uti epoxy resin gluten ad encapsulate et remedium. Superficies lucerna puncto resurgit in superficiem, quae lenis et durum repugnans collisionem et gerunt.
III. Magna viewing angle: Cob packaging utitur vadum bene sphaerica lucem emissionem, cum a viewing angulus major quam CLXXV gradus, claudere ad CLXXX gradus, et habet melius optical diffuse color effectus.
IV. Fortis æstus dissipatio facultatem: Cob products encapsulate lucerna in PCB tabula, et cito transferre calorem de linum per aeris ffoyle in PCB tabula. In addition, in crassitudine ex aeris ffoyle de PCB tabula habet strictam processus requisita, et aurum mergat processus mos vix causa gravis lux attenuatione. Itaque pauci mortua lampadibus, quae magna extenditur vita lucerna.
V. Gere, repugnans et securus ad mundare: superficies lucerna puncto convexa est in superficiem sphaericum, quod lenis et difficile repugnans ad collisionem et gerunt; Quod si non est malum punctum, potest reparari punctum punctum; Sine larva pulvis potest purgari aqua vel panno.
VI. Omnis, tempestas optimum habet, quod adoptat triplici praesidio curatio, cum outstanding effectus in IMPERVIUS, humorem, corrosio, pulvis, stabilis electricity, oxidatio, et ultraviolet; Hoc occurrit omnes-tempestate operantes condiciones et potest etiam esse solebat Northmanni in temperatus difference environment of minus XXX gradus ad plus LXXX gradus.
⚪Quid Gob packaging technology?
Cobor packaging est packaging technology launched ad oratio praesidii exitibus duci lucerna bads. Usus provectus transparent materiae ad encapsulate PCB subiectum et duci packaging unitas ad formam effective praesidium. Est equivalent ad addendo iacuit de praesidio in fronte de originali duxit moduli, ita achieving princeps protectionum munera et assequendum decem praesidium effectus inter IMPERVIUS, humorem-probationem, anti-probationem, anti-probationem, anti-salis, hyacintho, et anti-salis, hyacintho, et anti-vibration.
Quid commoda Gob packaging technology?
1. GOB process advantages: It is a highly protective LED display screen that can achieve eight protections: waterproof, moisture-proof, anti-collision, dust-proof, anti-corrosion, anti-blue light, anti-salt, and anti-static. Et non habebit nocivis effectus in æstus dissipatio et claritas damnum. Long-terminus rigorous probatio ostensum est quod tutum gluten et adjuvat dissipare calor, reduces in necrosis rate of lucerna bads, et facit screen magis firmum, ita extendens in ministerium vitae.
II. Per Gob processus processus, in granulares elementa super superficiem originale lucem tabulam transformari in an altiore plana lucem tabulam, ut superficiem de puncto punctum lux fons ad superficiem lucem fonte. The product emits light more evenly, the display effect is clearer and more transparent, and the product's viewing angle is greatly improved (both horizontally and vertically can reach nearly 180°), effectively eliminating moiré, significantly improving the product contrast, reducing glare and glare, and reducing visual fatigue.
⚪Quid est differentia inter Cob et Gob?
Differentia inter MANNUS et Gob est maxime in processus. Although the COB package has a flat surface and better protection than the traditional SMD package, the GOB package adds a glue filling process on the surface of the screen, which makes the LED lamp beads more stable, greatly reduces the possibility of falling off, and has stronger stability.
⚪Which unus habet commoda, MANNUS aut Gob?
Est non est signum in quo melius, MANNUS aut Gob, quia sunt plures factores ut iudicare num packaging processus est bonum vel non. Et clavem est videre quid value, utrum sit efficientiam DUXERIT lucerna Bads vel praesidio, ut quisque packaging technology habet suum commoda et non potest generalized.
Cum autem actu eligere, utrum ad Cob packaging aut Gob packaging debet considerari tandem coniunctim cum comprehensive factors ut nostra institutionem environment et operating tempore, et hoc quoque ad sumptus imperium et ostentationem.
Post tempus: Feb-06-2024
